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*product: Monolayers, Bilayers, Multilayers, Flexibles, Rigid-flexibles, Teflon, High Tg materials.
*Surface:Chemical Ni,Au
lectrolitical Ni, Au Hot Air Levelling Tin
*Lead Passivated Copper Chemical Tin Chemical Silver
*Final protections:Fotographic Solder, Serigraphic Solder, Fotographic Solder for flex Kapton,Component Silkscreen, Peelable. Kapton Cover Layer
*Materials: FR4, BT, POLYMIDE, TEFLON.DUROID,45 N, 85 N, T 200, T 200
KAPTON (elettroplated Cu), KAPTON (laminated Cu & epoxy adesive), MYLAR
*Protections: Fotographic Solder, Serigraphic Solder, Fotographic Solder for flex Kapton, Component Silkscreen, Peelable,Kapton Cover Layer
*Profile: Milling. Scoring,Punching, Punching for flex materials
Minimum hole :0.2 mm
Via hole type: Blind/Burried/plugged
Product: on demand
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